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IEC 60749-25 Ed. 1.0 b:2003 PDF

IEC 60749-25 Ed. 1.0 b:2003 PDF

Name:
IEC 60749-25 Ed. 1.0 b:2003 PDF

Published Date:
07/11/2003

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$28.5
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Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Edition : 1.0
File Size : 1 file , 650 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 25
Published : 07/11/2003

History

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