IEC 60191-6-18 Ed. 1.0 b COR. 2:2010 PDF

Name:
IEC 60191-6-18 Ed. 1.0 b COR. 2:2010 PDF

Published Date:
07/28/2010

Status:
Active

Description:

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Edition :	1.0
File Size :	1 file , 81 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	1
Published :	07/28/2010

History

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