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IEC 60191-6-22 Ed. 1.0 b:2012 PDF

IEC 60191-6-22 Ed. 1.0 b:2012 PDF

Name:
IEC 60191-6-22 Ed. 1.0 b:2012 PDF

Published Date:
12/11/2012

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$43.5
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IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Edition : 1.0
File Size : 1 file , 380 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 34
Published : 12/11/2012

History

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