IEC 60191-6-3 Ed. 1.0 en:2000 PDF

IEC 60191-6-3 Ed. 1.0 en:2000 PDF

Name:
IEC 60191-6-3 Ed. 1.0 en:2000 PDF

Published Date:
09/29/2000

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$31.2
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Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.
Edition : 1.0
File Size : 1 file , 180 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 17
Published : 09/29/2000

History

IEC 60191-6-3 Ed. 1.0 b:2000
Published Date: 09/29/2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
$43.5
IEC 60191-6-3 Ed. 1.0 en:2000
Published Date: 09/29/2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
$31.2

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