IEC 60191-6-3 Ed. 1.0 en:2000 PDF

Name:
IEC 60191-6-3 Ed. 1.0 en:2000 PDF

Published Date:
09/29/2000

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

Edition :	1.0
File Size :	1 file , 180 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	17
Published :	09/29/2000

History

IEC 60191-6-3 Ed. 1.0 b:2000

Published Date: 09/29/2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

$43.5

IEC 60191-6-3 Ed. 1.0 en:2000

Published Date: 09/29/2000

$31.2

Related products

IEC 60747-5-1 Ed. 1.2 b:2002

Published Date: 05/14/2002

Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General CONSOLIDATED EDITION

$94.5

IEC 60749-36 Ed. 1.0 b:2003

Published Date: 02/13/2003

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

$3.9

IEC 60191-6 Ed. 3.0 b:2009

Published Date: 11/26/2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

$83.4