IEC 60191-6-4 Ed. 1.0 b:2003 PDF

Published Date: 06/11/2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Published Date: 06/11/2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Published Date: 03/22/2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Published Date: 01/22/2008

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers CONSOLIDATED EDITION

Published Date: 01/23/2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Published Date: 01/15/2018

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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Calibration Laboratory Manager´s Guidebook

Published Date: 01/01/2017

Josephson Voltage Standard

Published Date: 08/01/1997

Quantized Hall Resistance

Published Date: 07/01/1998

Deadweight Pressure Gauges

Published Date: 01/01/2017

Two-Pressure, Two Temperature Humidity Generator

Published Date: 01/01/2004

Operation of Electric Utility Metrology Lab