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IEC 60191-6-6 Ed. 1.0 b:2001 PDF

IEC 60191-6-6 Ed. 1.0 b:2001 PDF

Name:
IEC 60191-6-6 Ed. 1.0 b:2001 PDF

Published Date:
03/22/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$28.5
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IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Edition : 1.0
File Size : 1 file , 310 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 25
Published : 03/22/2001

History

IEC 60191-6-6 Ed. 1.0 b:2001
IEC 60191-6-6 Ed. 1.0 b:2001
Published Date: 03/22/2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
$28.5
IEC 60191-6-6 Ed. 1.0 en:2001
IEC 60191-6-6 Ed. 1.0 en:2001
Published Date: 03/22/2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
$22.2

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