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IEC 60749-10 Ed. 2.0 b:2022 PDF

IEC 60749-10 Ed. 2.0 b:2022 PDF

Name:
IEC 60749-10 Ed. 2.0 b:2022 PDF

Published Date:
04/01/2022

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$28.5
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This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.


Edition : 2.0
File Size : 1 file , 940 KB
ISBN(s) : 9782832211004
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 28
Published : 04/01/2022

History

IEC 60749-10 Ed. 2.0 b:2022
IEC 60749-10 Ed. 2.0 b:2022
Published Date: 04/01/2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
$28.5
IEC 60749-10 Ed. 1.0 b:2002
IEC 60749-10 Ed. 1.0 b:2002
Published Date: 04/09/2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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