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IEC 60749-14 Ed. 1.0 b:2003 PDF

IEC 60749-14 Ed. 1.0 b:2003 PDF

Name:
IEC 60749-14 Ed. 1.0 b:2003 PDF

Published Date:
08/07/2003

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$28.5
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Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Edition : 1.0
File Size : 1 file , 570 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 27
Published : 08/07/2003

History

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