IEC 60749-20 Ed. 1.0 b:2002 PDF

Name:
IEC 60749-20 Ed. 1.0 b:2002 PDF

Published Date:
09/30/2002

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Edition :	1.0
File Size :	1 file , 1.7 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	49
Published :	09/30/2002

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