IEC 60749-23 Ed. 1.1 b:2011 PDF

IEC 60749-23 Ed. 1.1 b:2011 PDF

Name:
IEC 60749-23 Ed. 1.1 b:2011 PDF

Published Date:
03/30/2011

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life CONSOLIDATED EDITION

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$24.6
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IEC 60749-23:2004+A1:2011 is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard. This consolidated version consists of the first edition (2004) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
Edition : 1.1
File Size : 1 file , 320 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 03/30/2011

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