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IEC 60191-6-19 Ed. 1.0 b:2010 PDF

IEC 60191-6-19 Ed. 1.0 b:2010 PDF

Name:
IEC 60191-6-19 Ed. 1.0 b:2010 PDF

Published Date:
02/25/2010

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$28.5
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IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
Edition : 1.0
File Size : 1 file , 1.5 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 25
Published : 02/25/2010

History

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