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IEC 60749-30 Ed. 1.0 b:2005 PDF

IEC 60749-30 Ed. 1.0 b:2005 PDF

Name:
IEC 60749-30 Ed. 1.0 b:2005 PDF

Published Date:
01/20/2005

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$24.6
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Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
Edition : 1.0
File Size : 1 file , 380 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 27
Published : 01/20/2005

History

IEC 60749-30 Ed. 2.0 b:2020
IEC 60749-30 Ed. 2.0 b:2020
Published Date: 08/17/2020
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$28.5
IEC 60749-30 Ed. 1.1 b:2011
IEC 60749-30 Ed. 1.1 b:2011
Published Date: 08/10/2011
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION
$42.3
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
Published Date: 05/25/2011
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$6.9
IEC 60749-30 Ed. 1.0 b:2005
IEC 60749-30 Ed. 1.0 b:2005
Published Date: 01/20/2005
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$24.6

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