Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. IEC
  3. IEC 60749-30 Ed. 1.1 b:2011 PDF

IEC 60749-30 Ed. 1.1 b:2011 PDF

IEC 60749-30 Ed. 1.1 b:2011 PDF

Name:
IEC 60749-30 Ed. 1.1 b:2011 PDF

Published Date:
08/10/2011

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$42.3
Need Help?
IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
Edition : 1.1
File Size : 1 file , 360 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 28
Published : 08/10/2011

History

IEC 60749-30 Ed. 2.0 b:2020
IEC 60749-30 Ed. 2.0 b:2020
Published Date: 08/17/2020
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$28.5
IEC 60749-30 Ed. 1.1 b:2011
IEC 60749-30 Ed. 1.1 b:2011
Published Date: 08/10/2011
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION
$42.3
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
IEC 60749-30 Amd.1 Ed. 1.0 b:2011
Published Date: 05/25/2011
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$6.9
IEC 60749-30 Ed. 1.0 b:2005
IEC 60749-30 Ed. 1.0 b:2005
Published Date: 01/20/2005
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
$24.6

Related products

IEC 60749-15 Ed. 3.0 b:2020
IEC 60749-15 Ed. 3.0 b:2020
Published Date: 07/14/2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
$15.3
IEC 60749-17 Ed. 2.0 b:2019
IEC 60749-17 Ed. 2.0 b:2019
Published Date: 03/28/2019
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
$15.3
IEC 60749-9 Ed. 2.0 b:2017
IEC 60749-9 Ed. 2.0 b:2017
Published Date: 03/03/2017
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
$15.3

Best-Selling Products

B11 B11.0-2010
B11 B11.0-2010
Published Date: 12/02/2010
Safety of Machinery; General Requirements and Risk Assessment
B11 B11.0-2020
B11 B11.0-2020
Published Date: 12/16/2019
Safety of Machinery
B11 B11.0-2023
B11 B11.0-2023
Published Date: 06/27/2023
Safety of Machinery
$71.7
B11 B11.1-2001
B11 B11.1-2001
Published Date: 01/01/2001
Safety Requirements for Mechanical Power Presses
B11 B11.1-2009 (R2020)
B11 B11.1-2009 (R2020)
Published Date: 04/07/2009
Safety Requirements for Mechanical Power Presses
$29.7
B11 B11.10-2003 (R2015)
B11 B11.10-2003 (R2015)
Published Date: 08/26/2003
Safety Requirements for Metal Sawing Machines
$23.7