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IEC 60749-34 Ed. 1.0 b:2004 PDF

IEC 60749-34 Ed. 1.0 b:2004 PDF

Name:
IEC 60749-34 Ed. 1.0 b:2004 PDF

Published Date:
03/10/2004

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$16.8
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Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
Edition : 1.0
File Size : 1 file , 510 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 21
Published : 03/10/2004

History

IEC 60749-34 Ed. 2.0 b:2010
IEC 60749-34 Ed. 2.0 b:2010
Published Date: 10/28/2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
$15.3
IEC 60749-34 Ed. 1.0 b:2005
IEC 60749-34 Ed. 1.0 b:2005
Published Date: 11/21/2005
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
$16.8
IEC 60749-34 Ed. 1.0 b:2004
IEC 60749-34 Ed. 1.0 b:2004
Published Date: 03/10/2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
$16.8

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