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  3. IEC 61188-5-2 Ed. 1.0 b:2003 PDF

IEC 61188-5-2 Ed. 1.0 b:2003 PDF

IEC 61188-5-2 Ed. 1.0 b:2003 PDF

Name:
IEC 61188-5-2 Ed. 1.0 b:2003 PDF

Published Date:
06/24/2003

Status:
Active

Description:

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$110.1
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Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Edition : 1.0
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 103
Published : 06/24/2003

History

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