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IEC 61188-5-6 Ed. 1.0 b:2003 PDF

IEC 61188-5-6 Ed. 1.0 b:2003 PDF

Name:
IEC 61188-5-6 Ed. 1.0 b:2003 PDF

Published Date:
01/23/2003

Status:
Active

Description:

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$43.5
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Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
Edition : 1.0
File Size : 1 file , 380 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 37
Published : 01/23/2003

History

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