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IEC 62137 Ed. 1.0 b:2005 PDF

IEC 62137 Ed. 1.0 b:2005 PDF

Name:
IEC 62137 Ed. 1.0 b:2005 PDF

Published Date:
02/14/2005

Status:
Active

Description:

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$38.4
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This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
Edition : 1.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 57
Published : 02/14/2005

History

IEC 62137 Ed. 1.0 b:2005
IEC 62137 Ed. 1.0 b:2005
Published Date: 02/14/2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
$38.4
IEC 62137 Ed. 1.0 b:2004
IEC 62137 Ed. 1.0 b:2004
Published Date: 07/06/2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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