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IEC 61188-6-1 Ed. 1.0 b:2021 PDF

IEC 61188-6-1 Ed. 1.0 b:2021 PDF

Name:
IEC 61188-6-1 Ed. 1.0 b:2021 PDF

Published Date:
02/23/2021

Status:
Active

Description:

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$83.4
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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
Edition : 1.0
File Size : 1 file , 5.7 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 63
Published : 02/23/2021

History

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