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IEC 61188-6-2 Ed. 1.0 b:2021 PDF

IEC 61188-6-2 Ed. 1.0 b:2021 PDF

Name:
IEC 61188-6-2 Ed. 1.0 b:2021 PDF

Published Date:
02/04/2021

Status:
Active

Description:

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$57
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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
Edition : 1.0
File Size : 1 file , 2.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 49
Published : 02/04/2021

History

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