IEC 61189-2-803 Ed. 1.0 b:2023 PDF

Name:
IEC 61189-2-803 Ed. 1.0 b:2023 PDF

Published Date:
07/01/2023

Status:
Active

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).

Edition :	1.0
File Size :	1 file , 710 KB
ISBN(s) :	9782832272640
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	20
Published :	07/01/2023

History

Related products

IEC 61189-2 Ed. 2.0 en:2006

Published Date: 05/30/2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

$125.1

IEC 61188-5-2 Ed. 1.0 b:2003

Published Date: 06/24/2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

$110.1

IEC 61249-2-27 Ed. 1.0 b:2012

Published Date: 11/29/2012

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

$57

IEC 62899-202-4 Ed. 1.0 en:2021

Published Date: 10/01/2021

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

$57