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IEC 61190-1-3 Ed. 1.0 b:2002 PDF

IEC 61190-1-3 Ed. 1.0 b:2002 PDF

Name:
IEC 61190-1-3 Ed. 1.0 b:2002 PDF

Published Date:
03/22/2002

Status:
[ Withdrawn ]

Description:

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$33
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Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Edition : 1.0
File Size : 1 file , 590 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 65
Published : 03/22/2002

History

IEC 61190-1-3 Ed. 2.0 b:2007
IEC 61190-1-3 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$70.5
IEC 61190-1-3 Ed. 2.0 en:2007
IEC 61190-1-3 Ed. 2.0 en:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$42.9
IEC 61190-1-3 Ed. 1.0 b:2002
IEC 61190-1-3 Ed. 1.0 b:2002
Published Date: 03/22/2002
Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$33

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