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IEC 61190-1-3 Ed. 2.0 b:2007 PDF

IEC 61190-1-3 Ed. 2.0 b:2007 PDF

Name:
IEC 61190-1-3 Ed. 2.0 b:2007 PDF

Published Date:
04/26/2007

Status:
Active

Description:

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$70.5
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IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
Edition : 2.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 71
Published : 04/26/2007

History

IEC 61190-1-3 Ed. 2.0 b:2007
IEC 61190-1-3 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$70.5
IEC 61190-1-3 Ed. 2.0 en:2007
IEC 61190-1-3 Ed. 2.0 en:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$42.9
IEC 61190-1-3 Ed. 1.0 b:2002
IEC 61190-1-3 Ed. 1.0 b:2002
Published Date: 03/22/2002
Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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