IEC 61191-3 Ed. 1.0 b:1998 PDF

IEC 61191-3 Ed. 1.0 b:1998 PDF

Name:
IEC 61191-3 Ed. 1.0 b:1998 PDF

Published Date:
08/28/1998

Status:
[ Withdrawn ]

Description:

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$24.6
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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Edition : 1.0
File Size : 1 file , 530 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 31
Published : 08/28/1998

History

IEC 61191-3 Ed. 2.0 b:2017
Published Date: 05/30/2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$43.5
IEC 61191-3 Ed. 2.0 en:2017
Published Date: 05/30/2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$43.5
IEC 61191-3 Ed. 1.0 b:1998
Published Date: 08/28/1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$24.6

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