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IEC 61191-3 Ed. 2.0 en:2017 PDF

IEC 61191-3 Ed. 2.0 en:2017 PDF

Name:
IEC 61191-3 Ed. 2.0 en:2017 PDF

Published Date:
05/30/2017

Status:
Active

Description:

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$43.5
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IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.


Edition : 2.0
File Size : 1 file , 470 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 20
Published : 05/30/2017

History

IEC 61191-3 Ed. 2.0 b:2017
IEC 61191-3 Ed. 2.0 b:2017
Published Date: 05/30/2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$43.5
IEC 61191-3 Ed. 2.0 en:2017
IEC 61191-3 Ed. 2.0 en:2017
Published Date: 05/30/2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$43.5
IEC 61191-3 Ed. 1.0 b:1998
IEC 61191-3 Ed. 1.0 b:1998
Published Date: 08/28/1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
$24.6

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