IEC 61192-4 Ed. 1.0 b:2002 PDF

IEC 61192-4 Ed. 1.0 b:2002 PDF

Name:
IEC 61192-4 Ed. 1.0 b:2002 PDF

Published Date:
11/29/2002

Status:
[ Withdrawn ]

Description:

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$59.7
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Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Edition : 1.0
File Size : 1 file , 3.5 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 59
Published : 11/29/2002

History


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