Name:
IEC 61192-2 Ed. 1.0 b:2003 PDF

Published Date:
03/14/2003

Status:
[ Withdrawn ]

Description:

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Edition :	1.0
File Size :	1 file , 5.8 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	127
Published :	03/14/2003

History

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