IEC 62047-13 Ed. 1.0 b:2012 PDF

IEC 62047-13 Ed. 1.0 b:2012 PDF

Name:
IEC 62047-13 Ed. 1.0 b:2012 PDF

Published Date:
02/28/2012

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$28.5
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IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.
Edition : 1.0
File Size : 1 file , 510 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 30
Published : 02/28/2012

History


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