IEC 62047-9 Ed. 1.0 b:2011 PDF

IEC 62047-9 Ed. 1.0 b:2011 PDF

Name:
IEC 62047-9 Ed. 1.0 b:2011 PDF

Published Date:
07/13/2011

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$57
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IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters.
Edition : 1.0
File Size : 1 file , 680 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 49
Published : 07/13/2011

History


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