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IEC 62137-1-1 Ed. 1.0 b:2008 PDF

IEC 62137-1-1 Ed. 1.0 b:2008 PDF

Name:
IEC 62137-1-1 Ed. 1.0 b:2008 PDF

Published Date:
05/14/2008

Status:
Active

Description:

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$23.1
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The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Edition : 1.0
File Size : 1 file , 1000 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 30
Published : 05/14/2008

History

IEC 62137-1-1 Ed. 1.0 b:2008
IEC 62137-1-1 Ed. 1.0 b:2008
Published Date: 05/14/2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
$23.1
IEC 62137-1-1 Ed. 1.0 en:2007
IEC 62137-1-1 Ed. 1.0 en:2007
Published Date: 07/11/2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
$21.3
IEC 62137-1-1 Ed. 1.0 b:2007
IEC 62137-1-1 Ed. 1.0 b:2007
Published Date: 07/11/2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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