IEC 62137-1-4 Ed. 1.0 b:2009 PDF

IEC 62137-1-4 Ed. 1.0 b:2009 PDF

Name:
IEC 62137-1-4 Ed. 1.0 b:2009 PDF

Published Date:
01/26/2009

Status:
Active

Description:

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$28.5
Need Help?
The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
Edition : 1.0
File Size : 1 file , 980 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 25
Published : 01/26/2009

History


Related products

IEC 60068-2-21 Ed. 7.0 b:2021
Published Date: 07/01/2021
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
$98.7
IEC 62137-1-1 Ed. 1.0 b:2008
Published Date: 05/14/2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
$23.1
IEC 62137-1-5 Ed. 1.0 b:2009
Published Date: 02/11/2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
$57

Best-Selling Products

Designing Web Usability
Published Date: 12/20/1999
$13.5
Switched, Fast, and Gigabit Ethernet
Published Date: 12/30/1998
$15