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IEC 62878-1 Ed. 1.0 b:2019 PDF

IEC 62878-1 Ed. 1.0 b:2019 PDF

Name:
IEC 62878-1 Ed. 1.0 b:2019 PDF

Published Date:
10/14/2019

Status:
Active

Description:

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$43.5
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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
Edition : 1.0
File Size : 1 file , 1.6 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 38
Published : 10/14/2019

History

IEC 62878-1 Ed. 1.0 b:2019
IEC 62878-1 Ed. 1.0 b:2019
Published Date: 10/14/2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
$43.5
IEC 62878-1 Ed. 1.0 en:2019
IEC 62878-1 Ed. 1.0 en:2019
Published Date: 10/01/2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
$43.5

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