Name:
IPC 2251 PDF
Published Date:
11/01/2003
Status:
Active
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions.
| File Size : | 1 file , 1 MB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 99 |
| Published : | 11/01/2003 |
