Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.
| ANSI : | ANSI Approved |
| File Size : | 1
file
, 1.5 MB |
| ISBN(s) : | 1580986803 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 30 |
| Published : | 12/01/2010 |
