Name:
IPC 2294 PDF
Published Date:
06/01/2024
Status:
Active
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates as applies to this standard are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.
| File Size : | 1 file , 2.5 MB |
| ISBN(s) : | 9781638161752 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 52 |
| Product Code(s) : | 2294-STD-0-D-0-EN-0, 2294-STD-0-D-0-EN-0 |
| Published : | 06/01/2024 |
