IPC 4563 PDF

IPC 4563 PDF

Name:
IPC 4563 PDF

Published Date:
11/01/2007

Status:
Active

Description:

Resin Coated Copper Foil for Printed Boards Guideline

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
ipc-4563_1537325

Choose Document Language:
30.30 €
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This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
File Size : 1 file , 270 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 19
Published : 11/01/2007

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