IPC 6015 PDF

IPC 6015 PDF

Name:
IPC 6015 PDF

Published Date:
02/01/1998

Status:
Active

Description:

Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$30.3
Need Help?
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
File Size : 1 file , 1.2 MB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 25
Product Code(s) : 6015(D)1
Published : 02/01/1998

History


Related products

IPC SM-840E
Published Date: 12/01/2010
Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials
$30.3
IPC DD-135
Published Date: 08/01/1995
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
$19.5
IPC MC-790
Published Date: 08/01/1992
Guidelines for Multichip Module Technology Utilization
$54.6
IPC S-100
Published Date:
Standards and Specifications Manual - Four Volume Set - Two Year Subscription Included
$429.3

Best-Selling Products

ANSI/BIFMA e3-2010
Published Date: 2010
Furniture Sustainability Standard
ANSI/BIFMA e3-2011e
Published Date: 2011
Furniture Sustainability Standard
ANSI/BIFMA e3-2012e
Published Date: 2012
Furniture Sustainability Standard
ANSI/BIFMA e3-2014e
Published Date: 2014
Furniture Sustainability Standard
ANSI/BIFMA e3-2019
Published Date: 2019
Furniture Sustainability Standard
ANSI/BIFMA SOHO S6.5-2001
Published Date: 2001
American National Standard for Small Office/Home Office Furniture - Tests