IPC 6801 PDF

IPC 6801 PDF

Name:
IPC 6801 PDF

Published Date:
01/01/2000

Status:
Active

Description:

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$40.5
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Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.
Edition : 1st
File Size : 1 file , 430 KB
ISBN(s) : 1580982395
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 41
Published : 01/01/2000

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