This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
| File Size : | 1
file
, 210 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 12 |
| Part of : | IPC M109, IPC 9500-K |
| Product Code(s) : | 9502(D)1 |
| Published : | 04/01/1999 |
