The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification.
| File Size : | 1
file
, 170 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 19 |
| Part of : | IPC M109, IPC 9500-K |
| Product Code(s) : | 9503(D)1 |
| Published : | 04/01/1999 |
