Name:
IPC 9701B PDF
Published Date:
02/01/2022
Status:
Active
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
| File Size : | 1 file , 1 MB |
| ISBN(s) : | 9781638160724 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 24 |
| Product Code(s) : | 9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B |
| Published : | 02/01/2022 |
