Provides specific test methods used in the establishment of levels of performance and reliability for surface mount solder attachments of electronic assemblies. In addition to an understanding of the physics of surface mount solder joint failure, this document also provides an approximate means of relating the results from the performance test methods included to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
| File Size : | 1
file
, 300 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 22 |
| Product Code(s) : | 9701(D)1, 9701(D)1 |
| Published : | 01/01/2002 |
