IPC EMBPAS03 PDF

IPC EMBPAS03 PDF

Name:
IPC EMBPAS03 PDF

Published Date:
07/01/2003

Status:
Active

Description:

IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" - Northbrook, IL - June 2003

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$34.2
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Reducing the size and complexity of circuit boards is essential for companies to meet market demand. In major product sectors, passive resistors and components represent a significant fraction of the solder joints, consume almost half the surface area and account for the majority of the component placements. Embedded passives technology can allow significant reduction in the number of these surface passives. An enabling technology for the electronics industry, for North American PCB manufacturers its implementation can provide significant product and service differentiation from offshore competitors. This international conference held June 2003 brought together speakers from Japan, Finland, Singapore, Taiwan and the United States to address this critical new technology.
Note : This product is unavailable in Russia, Ukraine, Belarus
Published : 07/01/2003

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