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IPC J-STD-033D PDF

IPC J-STD-033D PDF

Name:
IPC J-STD-033D PDF

Published Date:
03/01/2018

Status:
Active

Description:

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

Publisher:
Association Connecting Electronics Industries

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$30.3
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IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
File Size : 1 file , 2.4 MB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 32
Product Code(s) : J033-STD-0-D-0-EN-D, J033-STD-0-D-0-EN-D
Published : 03/01/2018

History

IPC J-STD-033D
IPC J-STD-033D
Published Date: 03/01/2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$30.3
IPC J-STD-033C
IPC J-STD-033C
Published Date: 02/01/2012
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
$29.1
IPC J-STD-033B
IPC J-STD-033B
Published Date: 10/01/2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
$29.1
IPC J-STD-033
IPC J-STD-033
Published Date: 04/01/1999
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
$25.8

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