This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications.
| File Size : | 1
file
, 120 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 10 |
| Published : | 06/01/2002 |
