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IPC J-STD-033C PDF

IPC J-STD-033C PDF

Name:
IPC J-STD-033C PDF

Published Date:
02/01/2012

Status:
Active

Description:

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)

Publisher:
Association Connecting Electronics Industries

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$29.1
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Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented.
File Size : 1 file , 710 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 28
Published : 02/01/2012

History

IPC J-STD-033D
IPC J-STD-033D
Published Date: 03/01/2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$30.3
IPC J-STD-033C
IPC J-STD-033C
Published Date: 02/01/2012
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
$29.1
IPC J-STD-033B
IPC J-STD-033B
Published Date: 10/01/2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)
$29.1
IPC J-STD-033
IPC J-STD-033
Published Date: 04/01/1999
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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