Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision D incorporates resistance requirements to lead free soldering processes.
| ANSI : | ANSI Approved |
| File Size : | 1
file
, 260 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 16 |
| Published : | 04/01/2007 |
