Name:
IPC T-50G PDF
Published Date:
12/01/2003
Status:
Active
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
| File Size : | 1 file , 1.4 MB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 135 |
| Published : | 12/01/2003 |
