This document summarizes the IPC position on the subject of "halogen-free" materials for the electronics industry. Its initial release was developed over a period of three years and this revision is also the culmination of another three years of work by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007.
| File Size : | 1
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| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 33 |
| Published : | 08/01/2007 |
