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JEDEC JEP140 (R2006) PDF

JEDEC JEP140 (R2006) PDF

Name:
JEDEC JEP140 (R2006) PDF

Published Date:
06/01/2002

Status:
Active

Description:

BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$16.2
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The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
File Size : 1 file , 72 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 13
Published : 06/01/2002

History

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