JEDEC JEP167 PDF

Name:
JEDEC JEP167 PDF

Published Date:
04/01/2013

Status:
Active

Description:

Characterization of Interfacial Adhesion in Semiconductor Packages

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

File Size :	1 file , 280 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	30
Published :	04/01/2013

History

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JEDEC JEP167 PDF

Characterization of Interfacial Adhesion in Semiconductor Packages

History

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