JEDEC JEP167 PDF

JEDEC JEP167 PDF

Name:
JEDEC JEP167 PDF

Published Date:
04/01/2013

Status:
Active

Description:

Characterization of Interfacial Adhesion in Semiconductor Packages

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Czech version):

200 business days

SKU:

jedec-jep167_1856320

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

File Size :	1 file , 280 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	30
Published :	04/01/2013

History

Published Date: 11/01/2020

Characterization of Interfacial Adhesion in Semiconductor Packages

21.60 €

Published Date: 04/01/2013

Characterization of Interfacial Adhesion in Semiconductor Packages

21.60 €

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